Proposition of IGBT modules assembling technologies for aeronautical applications
Konferenz: CIPS 2008 - 5th International Conference on Integrated Power Electronics Systems
11.03.2008 - 13.03.2008 in Nuremberg, Germany
Tagungsband: CIPS 2008
Seiten: 6Sprache: EnglischTyp: PDF
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Autoren:
Zéanh, A.; Bouzourene, A.; Casutt, J. (THALES Avionics Electrical Systems. 41 boulevard de la république - BP 53, 78401 Chatou, France)
Zéanh, A.; Dalverny, O.; Karama, M. (ENI de Tarbes – LGP. 47, avenue d’Azereix - BP 1629, 65016 Tarbes Cedex, France)
Zéanh, A.; Woirgard, E.; Azzopardi, S. (Université Bordeaux – Laboratoire IMS. 351 cours de la Libération, 33405 Talence Cedex, France)
Zéanh, A.; Mermet-Guyennet, M. (PEARL, Alstom Transport Tarbes. Rue du Docteur Guinier - BP4, 65600 Séméac, France)
Inhalt:
In this paper, two IGBT (Insulated Gate Bipolar Transistor) modules assembling technologies with double side cooling capabilities and high level of integration are proposed for aeronautic applications after a state of the art and failures analysis. These technologies are compared using Design of Experiment based on non-linear Finite Element Analysis with various materials, with respect to their potential failures under thermal and power loading profiles. The configurations optimizing the lifetime and reliability level were pointed out by loading profile and failure mode. Then recommendations were done in order to choose the optimal configuration of assembly for each application.