Investigation on Pad-Edge Effects at Multi-layer Packaging containing Grounding Via Arrays
Konferenz: GeMIC 2008 - German Microwave Conference
10.03.2008 - 12.03.2008 in Hamburg-Harburg, Germany
Tagungsband: GeMIC 2008
Seiten: 4Sprache: EnglischTyp: PDF
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Autoren:
Buchta, M. (AiF Berlin, Arbeitsgemeinschaft industrieller Forschungsvereinigungen, Tschaikowskistr. 49, D-13156 Berlin, Germany)
Heinrich, W. (Ferdinand-Braun-Institut (FBH), Gustav-Kirchhoff-Str. 4, D-12489 Berlin, Germany)
Inhalt:
Via arrays for grounding have to be carefully designed not only regarding the via pitch but also with respect to the edges of the resulting pad. At a certain frequency an unwanted wave propagation occurs along the pad edges. This paper provides a detailed analytical and numerical analysis of this crosstalk effect, together with experimental verification. The simplified model achieves very good agreement over a broad range of edge geometries.