IEC 60749-37:2022
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
Ausgabedatum:
2022-10
Edition:
2.0
Sprache: EN-FR - zweisprachig englisch/französisch
Seitenzahl: 43 VDE-Artnr.: 251235
IEC 60749-37:2022 provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test. This edition includes the following significant technical changes with respect to the previous edition:
- correction of a previous technical error concerning test conditions;
- updates to reflect improvements in technology.