IEC TR 63378-1:2021
Thermal standardization on semiconductor packages - Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
Ausgabedatum:
2021-12
Edition:
1.0
Sprache: EN - englisch
Seitenzahl: 20 VDE-Artnr.: 250571
IEC TR 63378-1:2021(E) specifies the terms and definitions that are commonly used for thermal characteristics of BGA and QFP type semiconductor packages, and guidelines to use these thermal characteristics.