IEC 60191-4:2013+AMD1:2018 CSV (Consolidated Version)
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
Ausgabedatum:
2018-03
Edition:
3.1
Sprache: EN-FR - zweisprachig englisch/französisch
Seitenzahl: 152 VDE-Artnr.: 225502
IEC 60191-4:2013+A1:2018 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages. The descriptive designator provides a useful communication tool but has no implied control for assuring package interchangeability. This edition includes the following significant technical changes with respect to the previous edition:
a) Material code 'S' is added to indicate a silicon based package.
b) Description of 'WL' is added to be used for general use. This consolidated version consists of the third edition (2013) and its amendment 1 (2018). Therefore, no need to order amendment in addition to this publication.