IEC 60191-6-2:2001/COR1:2002

Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

Ausgabedatum: 2002-10
Edition: 1.0
Sprache: EN - englisch
Seitenzahl: 1 VDE-Artnr.: 222831