IEC 60191-6-3:2000
Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
Ausgabedatum:
2000-09
Edition:
1.0
Sprache: EN-FR - zweisprachig englisch/französisch
Seitenzahl: 34 VDE-Artnr.: 219589
IEC 60191-6-3:2000 stipulates a method for quad flat packs (QFP) measuring dimensions which are classified into Form E.