IEC 60191-6-4:2003
Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
Ausgabedatum:
2003-06
Edition:
1.0
Sprache: EN-FR - zweisprachig englisch/französisch
Seitenzahl: 32 VDE-Artnr.: 219482
IEC 60191-6-4:2003 covers the requirements for the measuring methods of ball grid array (BGA) dimensions.