IEC 60191-6-18:2010
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
Ausgabedatum:
2010-01
Edition:
1.0
Sprache: EN-FR - zweisprachig englisch/französisch
Seitenzahl: 40 VDE-Artnr.: 216953
IEC 60191-6-18:2010 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger. This standard cancels and replaces IEC/PAS 60191-6-18 published in 2008. This first edition constitutes a technical revision.The contents of the corrigenda of May 2010 and July 2010 have been included in this copy.