IEC 60749-16:2003
Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)
Ausgabedatum:
2003-01
Edition:
1.0
Sprache: EN-FR - zweisprachig englisch/französisch
Seitenzahl: 13 VDE-Artnr.: 210451
Defines a test aiming at detecting the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).