IEC 61190-1-1:2002
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
Ausgabedatum:
2002-03
Edition:
1.0
Sprache: EN-FR - zweisprachig englisch/französisch
Seitenzahl: 41 VDE-Artnr.: 200891
Specifies general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics assembly. This standard is a flux characterization, quality control, and procurement document for solder flux and flux containing material in electronics assembly technology.