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E DIN EN IEC 60749-21 VDE 0884-749-21:2025-04

Semiconductor devices – Mechanical and climatic test methods

Part 21: Solderability

(IEC 47/2862/CDV:2024); German and English version prEN IEC 60749-21:2024
Class/Status: Draft, valid
Released: 2025 -04 Published: 2025-03 -28
VDE Art. No.: 1800929
End of objection deadline: 2025-05-28

This part of DIN EN 60749 specifies a standard test method for determining the solderability of component housing connections which are intended to be connected to other surfaces during component assembly by using tin-lead solders (SnPb solders) or lead-free solders (Pb-free solders).

This Document is related to the following Topics (in bold):

31	ELECTRONICS
31.020	Electronic components in general
31.040	Resistors
31.060	Capacitors
31.080	Semiconductor devices
31.120	Electronic display devices
31.140	Piezoelectric devices
31.160	Electric filters
31.180	Printed circuits and boards
31.190	Electronic component assemblies
31.200	Integrated circuits. Microelectronics
31.220	Electromechanical components for electronic and telecommunications equipment
31.240	Mechanical structures for electronic equipment
31.260	Optoelectronics. Laser equipment

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E DIN EN IEC 60749-21 VDE 0884-749-21:2025-04

Semiconductor devices – Mechanical and climatic test methods

Part 21: Solderability

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