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DIN EN IEC 63251 VDE 0885-201:2024-07

Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress

(IEC 63251:2023); German version EN IEC 63251:2023
Class/Status: Standard, valid
Released: 2024-07
VDE Art. No.: 0800979

This standard defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards. The purpose of this standard is to accommodate the uniform thermal characteristics required by the flexible opto-electric circuit in high temperature environments such as automobiles. In particular, this standard specifies a test method to inspect the occurrence of color exchange, deformation and delamination of flexible opto-electric circuit boards under thermal stress.

This Document is related to the following Topics (in bold):

31	ELECTRONICS
31.020	Electronic components in general
31.040	Resistors
31.060	Capacitors
31.080	Semiconductor devices
31.120	Electronic display devices
31.140	Piezoelectric devices
31.160	Electric filters
31.180	Printed circuits and boards
31.190	Electronic component assemblies
31.200	Integrated circuits. Microelectronics
31.220	Electromechanical components for electronic and telecommunications equipment
31.240	Mechanical structures for electronic equipment
31.260	Optoelectronics. Laser equipment

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DIN EN IEC 63251 VDE 0885-201:2024-07

Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress

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