Intelligent SiC Power Module for 2- and 3-level high voltage applications

Conference: PCIM Asia 2024 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
08/28/2024 - 08/30/2024 at Shenzhen, China

doi:10.30420/566414039

Proceedings: PCIM Asia 2024

Pages: 4Language: englishTyp: PDF

Authors:
Pluschke, Norbert

Abstract:
The paper introduces an intelligent high-power SiC module with optimized driver design and low stray inductance. The SiC-driver has integrated short circuit protection and is optimized for different SiC chip technologies . High-performance heat sink will help to increase the power density. Also we will introduce a 3-level-design with intellligent high-power module with Si chips.