Research on Reliability of Heavy Copper Wire Bonding for IGBT Module

Abstract:
In the advanced application of power electronic modules, the design and manufacture of power modules must meet the requirements of high frequency switching rate, high power density, high junction temperature, etc. With the increase of power density, the current carrying capacity of the terminal interconnection is required to be higher, and the traditional aluminum wire will have a higher temperature rise under a large current. Therefore, the use of copper terminal through-flow technology can support the establishment of higher power platforms. In this paper, we focus on the relationship between the properties of copper wire bonding and their reliability in IGBT module applications.