125KW PCS solution in high power density GWQ package

Abstract:
This paper introduces a new high power density package called GWQ. GWQ is the largest package for PCS applications. The test proves that the package will not deform in long-term use. The module uses the new M7I chip technology with the NPC-T topology. A single module can meet the power output of 125KW PCS. At the same time, it is obtained by simulation that the Sic MOSFET or Sic SBD mixed with IGBT can reduce the system loss by 15%~32% and increase the efficiency by 0.22%~0.55%. The Tjmax of the chip is reduced by 4~7 degrees Celsius through thermal simulation. Through the test data, the GWQ module scheme has excellent effect in 125KW PCS.