Characterization of the Bonding Quality of Silver Sintered Compounds by Means of Laser-Induced Breakdown Spectroscopy

Abstract:
In power electronics, the aim of bonding and joining technology is to continuously optimize the adhesion between the joining partners. The low-temperature sintering method has proven to be one of the most effective methods, especially under the aspect of constantly increasing requirements. In addition to the generation and optimization of the interconnection layers, this also leads to increasing demands on the analysis technology. Therefor the potential of laser-induced breakdown spectroscopy, a new analysis technique for power electronics, is investigated. In addition to the superficial measurement, a multiple measurement at one point is possible via an automatic refocusing, which allows depth profiles to be created. For example, a correlation was found between the extent of the fragmentation margins and the shear strength. The fragmentation margin is formed by the material evaporated for analysis and subsequently condensed, which forms around the crater of the measurement point.