Reliability Tests of Copper Thick-Film Substrates for Power Electronic Applications
Conference: PCIM Europe 2024 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
06/11/2024 - 06/13/2024 at Nürnberg, Germany
doi:10.30420/566262403
Proceedings: PCIM Europe 2024
Pages: 5Language: englishTyp: PDF
Authors:
Barth, Henry; Letz, Sebastian; Rebenklau, Lars
Abstract:
Copper thick-film substrates were produced at Fraunhofer IKTS with a commercial copper thick-film paste system and an IKTS proprietary copper paste to compare them with commercial DBC substrates. Thermal shock testing at IKTS resulted in a total failure of the DBC substrates after only 50 cycles. The copper thick-film substrates survived the planned 1000 temperature cycles without damage, though. Power cycling at Fraunhofer IISB showed a significantly lower reliability for copper thick-film substrates compared to the DBC reference. However, a 25 % higher characteristic lifetime was observed for the thick-film substrates compared to the DBC reference.