Thermal characterization of an air-cooled PEBB based on SiC MOSFET Power Modules

Abstract:
This paper presents the thermal characterization of an air-cooled Power Electronic Building Block (PEBB) based on two SiC MOSFET Power Modules. The experimental thermal transient response of the assembly is compared to a thermofluidic 3D model. The results show good agreement between the predicted and measured values and allow to validate the possibility to use conventional air-cooling technology for this high dissipation application. In the case of a power step, the transient thermal response of PT100 temperature sensors placed within the heatsink and their relevance to evaluate the converter operating temperature are also discussed. Finally, the impact of a partial loss of the cooling fans on the thermal performance of the assembly is experimentally evaluated.