Innovative 3D Power Module Defaults Detection via Thermal Impedance Analysis and Simulations
Conference: PCIM Europe 2024 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
06/11/2024 - 06/13/2024 at Nürnberg, Germany
doi:10.30420/566262398
Proceedings: PCIM Europe 2024
Pages: 8Language: englishTyp: PDF
Authors:
Alauzet, Louis; Castelan, Anne; Regnier, Sophie; Fradin, Jean-Pierre; Dezalay, Alexandre; Tounsi, Patrick
Abstract:
This article presents a method for detecting physical defects in an innovative 3D Silicon (Si) power module by measuring thermal impedance (Zth). A non-invasive method for measuring the junction temperature of dies is introduced (voltage drop across a diode under constant current), and a comparison is made with simulation results (CELSIUS EC SOLVER software). The observed differences are analyzed to propose hypotheses for defects origins and location. A scanning electron microscopy (SEM) observation is also used to validate these hypotheses. The results confirm that the comparison between experimental and simulation data of Zth is a precise method for determining the areas of physical defects.