All-in-One-Sintering: Die-attach and Substrate-attach on Bare Copper in a Pressure Assisted Sintering One-step Process

Abstract:
Using silver sintering for die-attach in power modules is common these days. With increasing power densities, switching frequencies and therefore changing from Si to SiC puts even more mechanical and thermal stress on these components. As of today, sintering of AMB or DBC materials or even molded modules is still a challenge, which makes Sn-solder and thermal interface materials (TIM) still the best and cheapest alternative. In this work we will showcase a material and a process, which allows us the industry to sinter established module designs, die- and substrate level, in one step.