Cold Plate Design for Cooling LV100 Silicon Carbide PowerModule Packaging

Abstract:
An experimental and numerical investigation on forced convective heat transfers in cold plate for cool ing LV100 power modules packaging is presented presented. An original design is used to build the cold plate. This study is conducted for a flow regime varying from 1500 < Reynolds < 7000. Thermal results show that the use of this efficienefficient design allows an increase in heat exchanges of around 60% compared to a basic geometry. In addition , this optimized design shows a good homogeneous temperature distribution be- tweetween power module chips. The maximum deviation between chips is lower than 4%.