Fabrication Development for Gate Driver Embedded Double-Sided Cooling SiC Power Module for Electric Vehicle Application

Abstract:
High power-density packaging power modules are essential components within electric vehicle inverters. Heterogeneous packaging techniques significantly influence system performance, especially concerning the integration of gate drivers and decoupling capacitors. This paper presents a comprehensive approach to fabricating a double-sided cooling power integrated with gate drivers, decoupling capacitors, and a low temperature co-fired ceramic (LTCC) interposer. The proposed module’s junction-to-case thermal resistance is 0.05 K/W and power commutation loop inductance is 2.3 nH. The fabrication process and electrical performance of the proposed module has been validated by Hi-Pot test and dou-ble pulse test.