Benefits of .XT Interconnection Technology for 3.3 kV XHP 2 Module with 3.3 kV CoolSiC MOSFET

Abstract:
CoolSiCTM MOSFETs enable operation at higher frequencies for high-voltage applications in the 3.3 kV voltage class. Equipped with CoolSiC(TM) MOSFETs, the Infineon 3.3 kV XHP(TM) 2 module enables high power densities in applications such as traction. With the trend towards higher power densities, robustness against failure such as surge current and short circuits is becoming increasingly important. Furthermore, traction applications demand high power cycling capabilities to ensure an ample service life of the power module. Combined with the Infineon .XT interconnect technology in an XHP(TM) 2 package, CoolSiC(TM) MOSFETs can address these requirements for traction applications. This paper describes the performance of the XHP(TM) 2 3.3 kV CoolSiC(TM) MOSFET .XT module with regard to surge current, short circuit, and power cycling.