Moisture Robust Chip Design – Improved Edge-Terminations for High Lifetime under High Humid Conditions
Conference: PCIM Europe 2024 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
06/11/2024 - 06/13/2024 at Nürnberg, Germany
doi:10.30420/566262071
Proceedings: PCIM Europe 2024
Pages: 10Language: englishTyp: PDF
Authors:
Kopta, Arnost; Hanf, Michael; Ju, Yanrui; Schnell, Raffael; Kaminski, Nando
Abstract:
In more and more applications and operation sites, power semiconductor modules are facing harsh environmental conditions. Especially moisture induced degradation is limiting the service life of Silicon- IGBT (Si-IGBT) modules and is the topic of a number of research activities. As moisture mainly stresses areas of high electrical fields, the focus is on the edge-termination. This work will contribute to the reliability enhancement under accelerated humidity testing by means of an improved edge-termination. Different designs are presented, which significantly increase the lifetime under HV-H3TRB conditions.