Investigation of Inorganic Encapsulation Materials in Power Electronic Systems for High Power Density Applications

Abstract:
A technological limitation of power electronic systems is the encapsulation which is generally realized with organic polymers. This work discusses the use of inorganic ceramic encapsulation materials in power electronic systems. Body of the investigation is an automotive traction system. Besides the power module (PM) components like peripheral electronics (PE) as well as the motor are inves tigated. It can be shown that regarding the PM bonding wire temperatures at high current density levels can be reduced significantly . Additionally, on PE it can be observed that environmental testing (i.e. TST ) is successfully passed. Also, the electrical performance of the electric motor can be improved.