Power Module Evaluation Using Ultra High Heat Dissipation and High Heat Resistance Resin Sheet Containing Boron Nitride Filler

Abstract:
SiC has the advantage of high-temperature operation at above 200 °C, but existing peripheral materials have not been sufficient in terms of heat resistance and durability. This research succeeded in developing a high heat-resistant module that enables continuous high-temperature operation of SiC by using a resin substrate with high heat dissipation of 20 W/(m·K), high heat resistance, and high insulation, which can withstand high temperature and high pressure. It achieved durability of 50,000 cycles at Tjmax 225 °C and 20,000 cycles at Tjmax 250 °C. It was confirmed that the module using the heat-dissipating resin substrate has almost reached the stage of practical application for the 200 °C high-temperature operation required for SiC.