30A/600V RC-IGBT Based Transfer Molded IPM for Home Appliance Application
Conference: PCIM Asia 2023 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
08/29/2023 - 08/31/2023 at Shanghai, China
doi:10.30420/566131048
Proceedings: PCIM Asia 2023
Pages: 4Language: englishTyp: PDF
Authors:
Kai, Jiang; Huang, HongGuang (Mitsubishi Electric & Electronics (Shanghai) Co., Ltd., China)
Joko, Motonobu (Power Device Works, Mitsubishi Electric Corporation, Japan)
Abstract:
This paper presents a new large rating current product in SLIMDIP(TM) series with part No. SLIMDIPZ (600V/30A). SLIMDIP(TM) integrates reverse conducting IGBT (RC-IGBT) as power chip, it can realize smaller package by reducing number of inner components compared with previous Super Mini DIPIPM(TM) series that is defector standard power module for inverterized home appliances. Although its package size becomes smaller, it has the same protection functions as Super Mini DIPIPM(TM) series and bootstrap diodes for P-side driving to supply. By virtue of these features, SLIMDIP(TM) is especially suitable for low cost inverterized home appliances application and can contribute to system cost reduction.