A Heterogeneously Integrated Double-Sided Cooled Power Module for Electric Vehicles

Abstract:
A half-bridge silicon carbide MOSFET double-sided cooled power module with integrated decoupling capacitors, gate drivers, and temperature sensors is designed and developed. A low-temperature co-fired ceramic-based interposer provides the module with its high mechanical strength and enhanced electrical isolation. The module’s 45-degree connection blocks, which allow significant heat extraction from the topside of die, offer better heat dissipation than state-of-the-art connection blocks. The module’s power loop inductance and junction-to-case thermal resistance, its key performance metrics, are 1.5 nH and 0.05 K/W, respectively. The developed fabrication process and the double pulse test simulation results at 800 V, 164 A are shown.