Active Metal Brazed Cu-Si3N4 Composites for Power Electronics
Conference: PCIM Europe 2023 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05/09/2023 - 05/11/2023 at Nürnberg, Germany
doi:10.30420/566091195
Proceedings: PCIM Europe 2023
Pages: 6Language: englishTyp: PDF
Authors:
Rost, Axel; Mosch, Sindy; Trofimenko, Nikolai; Gierth, Paul; Schilm, Jochen (Fraunhofer IKTS, Germany)
Abstract:
Using Active Metal Brazing (AMB) processes to join Copper to Si3N4 instead of Direct Copper Bonding (DCB) extends the lifetime of circuit boards (AMB-substrates) for power electronics by improved active and passive thermal cycling stabilities. A critical component for the lifetime of AMB-substrates is the fraction of silver in the active filler metals due to silver migration and short cutting of the copper-pads. A silver-free brazing process for Copper-Si3N4 AMB-substrates is presented to elongate the lifetime especially at high voltages. Peel strength and microstructure of the joining interface of silver-based and silverfree active filler metals are compared.