Influence of Humidity on Thermal Resistance of Power Devices
Conference: PCIM Europe 2023 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05/09/2023 - 05/11/2023 at Nürnberg, Germany
doi:10.30420/566091126
Proceedings: PCIM Europe 2023
Pages: 7Language: englishTyp: PDF
Authors:
Wang, Yanhao; Wu, Lixin; Yan, Yuxing; Xie, Luhong (State Key Laboratory of Alternate Electrical Power System with Renewable Energy Sources (North China Electric Power University), China)
Deng, Erping (NCEPU (Yantai) Power Semiconductor Technology Research Institute Co., Ltd, China & Hefei University of Technology, China)
Huang, Yongzhang (State Key Laboratory of Alternate Electrical Power System with Renewable Energy Sources (North China Electric Power University), China & NCEPU (Yantai) Power Semiconductor Technology Research Institute Co., Ltd, China)
Abstract:
Recently, more attention has been paid to the humidity-related failure of power devices, and some failure is related to thermal resistance increment at an early stage during aging tests. However, this phenomenon still needs further verification. In this article, the influence of humidity on the thermal resistance of power devices is studied based on three kinds of DUTs packaged with epoxy molding compound (EMC) and silica gel with/without baseplate. The results show that moisture can invade DUT and cause transient thermal impedance Zth variation in two aspects, one corresponds to the case surface of DUTs, and the other corresponds to the solder layer of DUTs.