ISOPLUS - SMPD: An Advanced Isolated Packaging to Fully Exploit the Advantages of SiC MOSFETs

Abstract:
Power semiconductors typically are presented in two types of packages: discrete and module. Though both seem to be innovative solutions of delivering semiconductor capability, each one is limited by its own anatomical and functional capacities. Discretes tend to be highly standardized often incorporating single switch configuration, whereas power modules feature complex package handling requirements often incorporating complete topology. Therefore, in an effort to bridge the gap between the two, Littelfuse offers an advanced isolated package, the SMPD, anchored with the performance of a power module and designed with the flexibility of a discrete. The SMPDs are available in standard power electronics building blocks to realize full topology by distributed arrangement of functional groups. This work compares the dynamic performance of the SMPD versus standard discrete packaging to highlight the advantages of the SMPD in Silicon Carbide (SiC) MOSFET based applications. Additionally, thermal measurements comparing the SMPD with different ceramics to standard TO-247 package show the SMPD proves to be the ideal choice when aiming to minimize chip junction temperatures and junction-heatsink thermal resistances. The better thermal performance of the SMPD leads to potential increase in application power output whilst attesting to greater system-level cost savings.