Towards Vertical GaN Power Transistors on Foreign Substrates: The European YESvGaN Project
Conference: PCIM Europe 2023 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05/09/2023 - 05/11/2023 at Nürnberg, Germany
doi:10.30420/566091002
Proceedings: PCIM Europe 2023
Pages: 6Language: englishTyp: PDF
Authors:
Huber, Christian; Reimer, Max; Regensburger, Stefan; Henn, Mirjam; Kaden, Thomas; Baringhaus, Jens (Robert Bosch GmbH, Corporate Research and Advance Engineering, Department for Advanced Technologies and Micro Systems, Renningen, Germany)
Abstract:
Fabrication of vertical GaN power transistors on foreign instead of native substrates is an attractive route for the industrialization of vertical GaN technology as it circumvents high cost and small diameter of currently available GaN wafers. However, this approach requires to remove the substrate and epitaxial buffer layers under the active area resulting in a thin membrane transistor. This technology is currently developed in the EU-funded project YESvGaN. The consortium has demonstrated avalanche capability of GaN-on-sapphire epitaxial layers, processing of fully vertical Schottky diodes and first steps towards the assembly of such thin dies.