Reflow Soldering of TO-247PLUS Discrete Package in Commercial, Construction and Agricultural Vehicle Application
Conference: PCIM Europe 2022 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05/10/2022 - 05/12/2022 at Nürnberg, Germany
doi:10.30420/565822144
Proceedings: PCIM Europe 2022
Pages: 7Language: englishTyp: PDF
Authors:
Harmon, Omar (Infineon Technologies Austria AG, Austria)
Zhao, Zhenbo (Infineon Technologies China Co. Ltd., China)
Hein, Lukas (Chemnitz University of Technology, Germany)
Abstract:
Many applications today use power semiconductors for high power density solutions. One challenge in designing such solutions is a good cooling system to relieve the heat dissipated by the devices. A discrete device that is mounted on a water-cooled heat sink via direct copper bonding (DCB) is one solution available to design engineers, assuming the discrete device can be mounted like a surface-mounted device (SMD). This paper will demonstrate a reflow, solder-capable TO-247PLUS discrete package that minimizes the thermal resistance from the device chip to the DCB substrate.