New Dimensions in Lock-In Thermography for Failure Classification in Electronics with New Thermographic Cameras in HD Resolution

Abstract:
For the large-scale production of electronic materials, efficient test methods are becoming increasingly important for quality assurance and process optimization. Today, thermographic damage and function analysis of electronic components using infrared (IR) cameras is an established test method in electrical engineering. Lock-In thermography (LIT) enables the localization of very weak local heat sources below the surface. For failure analysis (FA) and non-destructive testing (NDT) of electronic devices and integrated circuits Lock-In thermography is reliable standard method.