Design of Wire Bondless Double-Sided Cooled Power Module Using Ceramic Heat Sink and Multilayer Silver Sintering

Abstract:
In order to take the full advantages of Silicon Carbide (SiC) devices in high-frequency and high-power-density applications, a compact SiC power module assembly featuring low weight, low thermal resistance and capabilities to work in harsh thermal environment is proposed in this paper. The process flow allowing the manufacturing of a double-sided cooled phase leg power module with SiC MOSFETs sandwiched between two Aluminium Nitride (AlN) heat sinks is described. Experimental results showing the relationship between the sintering process and the relative density and electrical and thermal conductivities of the sintered silver layers are presented and discussed. In addition, the static electrical properties of the module show that both MOSFETS have kept their electrical functions at the end of the assembly. This allow highlighting the feasibility of double side cooled module with the suggested manufacturing process.