Numerical simulation of Temperature field and stress distribution for Inconel 718 by selective electron beam melting
Conference: MEMAT 2022 - 2nd International Conference on Mechanical Engineering, Intelligent Manufacturing and Automation Technology
01/07/2022 - 01/09/2022 at Guilin, China
Proceedings: MEMAT 2022
Pages: 5Language: englishTyp: PDF
Authors:
Ma, Binjun; Peng, Zhiguo; Liu, Hailang; Huang, Caimin; Ji, Chuanshang; Liu, Haiyang (College of Mechatronics Engineering, Guilin University of Electronic Science and Technology, Guilin, Guangxi, China)
Abstract:
ANSYS workbench was used to simulate the temperature field and stress distribution of Inconel 718 by selective electron beam melting. The results show that the surface temperature of the first layer reaches to 900°C due to heating by electron beam. The final surface temperature increases as the number of printing layer increases because of accumulating heat, is up to 3250°C for the third layer. The residual stress increases as the power increases. The maximum value of residual stress locates on the electron beam scanning finished regions and sides of scanning direction.