MEMAT 2022
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Shear strength of joint formed using Sn-58Bi/Cu porous structure via TLP bonding

Conference: MEMAT 2022 - 2nd International Conference on Mechanical Engineering, Intelligent Manufacturing and Automation Technology
01/07/2022 - 01/09/2022 at Guilin, China

Proceedings: MEMAT 2022

Pages: 4Language: englishTyp: PDF

Authors:
Xiong, Bifu; Lu, Huixiu; Bi, Yuhao; Huang, Jiaqiang (Guangxi Key Laboratory of Manufacturing System & Advanced Manufacturing Technology, School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin, Guangxi, China)
He, Siliang (Guangxi Key Laboratory of Manufacturing System & Advanced Manufacturing Technology, School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin, Guangxi, China & Institute of Semiconductors, Guangdong Academy of Sciences, Guangzhou, Guangdong, China)

Abstract:
Wide bandgap (WBG) power electronic devices operating at high power, high frequencies, and high temperature is widely used for this energy-smart world. Transient liquid phase (TLP) bonding has been developed for die-attach to suit the WBG device’s typical service environments at the low bonding temperature. In this study, thermal and pressure effects on shear strength of joint formed using Sn-58Bi solder/micro-size Cu porous/Sn-58Bi solder sandwich structure via TLP bonding under Formic Acid atmosphere was investigated. Cu porous was used as the intermediate metal layer, thin films of Sn-58Bi solder paste were spread on the top and bottom sides of Cu porous. Formic acid (FA) atmosphere was used during the bonding process to remove the Cu oxide film and prevent the re-oxidation of metals. The shear strength of samples continuedly increased with the heating time increased while the shear strength decreased when applied extra high temperature. And pressing a little pressure on the sample could improve the shear strength of the joint significantly. A successful TLP bonding using Sn-58Bi/Cu porous/Sn-58Bi sandwich structure under FA atmosphere was achieved in this study.