Reducing Design-For-Manufacturing Complexity with Tool-Free Solder Preform Technology for Power Module Assembly

Abstract:
Reliance on complex, costly alignment tooling is growing as power module designers seek improved solder reliability performance. A novel ad-hesive material technology, applied during assembly, eliminates the need for customized fixturing tools. This no-residue adhesive is demonstrated to achieve exceptional solderability without post-process cleaning steps. It is examined for compatibility with solder preforms and prevalent flux-free reflow techniques using formic acid, and empirical evidence confirms no residual impact. This results in less up-front design-for-manufacturing effort, reduced product introduction cycles, and lower capital investment, reducing the overall cost of owner-ship to achieve high quality solder performance for power module assembly.