Advanced Power Module Technologies for Wide Band Gap Devices

Abstract:
implemented by advanced power module technologies. Sintering Ag is one of high temperature die attach candidates, its shear strength keeps the same level before / after 175 °C and 250 °C more up to 2000hrs. Surge current test results show no different after high temperature aging test. Furthermore, Wire-less/ Wire-free module structures remove bond wires and contribute low thermal resistance (-20 % / -73 %). The new power modules, wire-less/ wire-free structures, are discussed in thermal, electric, stray inductance, and reliability fields in the work. Both of these two structures could improve cycle life reliability compared to the wire-bond type.