A new method for prediction of 2D chip temperature distributions in general purpose drive load profiles

Abstract:
Using parallel computing and a divide-and-conquer technique, a fast and accurate method is presented to enable 2D power-loss and temperature distributions of chips for load profiles in pulse-width modulated (PWM) two-level inverter applications. Because variations of the temperature and power losses on the chips are taken into account, a more accurate determination of the maximum module current for application-specific load and overload profiles is possible.