Simulation and verification of a lifetime model based on front side metal degradation of sintered Die Top Systems (DTS®) in Power Cycling Tests (PCT)

Abstract:
In previous studies we presented results from power cycling tests performed under variation of package design (bare DCB on cooler with thermal interface material or DCB on Cu heatsink mounted directly on cooler) and different Die-Top-System (DTS(exp (r)), Heraeus Electronics) material properties and thicknesses. All samples were wirebonded using Heareus’ power Cu soft wires. In order to understand the variation in lifetime of different setups and allow lifetime prediction prior to experiments, finite element method (FEM) was used to derive a lifetime model. First results based on fitting the data using a Morrow approach yield a promising correlation that enables to approximate lifetimes for different setups or to optimize the module design.