Thermal Solutions for Surface Mount Power Devices
Conference: PCIM Europe digital days 2020 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
07/07/2020 - 07/08/2020 at Deutschland
Proceedings: PCIM Europe digital days 2020
Pages: 4Language: englishTyp: PDF
Authors:
Shao, Jianwen; Solovey, James (Wolfspeed, A Cree Company, USA)
Wei, Frank (Wolfspeed, A Cree Company, China)
Zhao, Xin (University of Texas, Austin, USA)
Abstract:
The first part of the paper presents a Printed Circuits Board (PCB) thermal vias design recommendations for surface mount (SMT) power devices for relatively low power applications. Simulation is conducted to compare different thermal vias arrays. A PCB with different thermal vias array is fabricated, and thermal impedance is measured. The measured result confirms simulation results. The second part of the paper introduces an innovative ceramic-embedded Alumina Nitride (AlN) FR4 PCB solution for surface mount power devices in high power applications. This embedded AlN PCB solution provides excellent thermal conduction, and electrical isolation at same time. A simulation work is also conducted. And PCB is manufactured to verify the simulation result. Finally, a 6.6kW EV on-board charger power converter is developed based on this AlN-embedded PCB.