Wafer Level Silver Sintering Die Attach for Power Discretes

Abstract:
While silver sintering has emerged as the die-attach material of choice for high power devices (especially automotive modules), high-lead soft solder is still used for power discretes. As dies get thinner, temperature dependent RDS(on) (drain-to-source resistance) is becoming the bottleneck for meeting the electrical requirements. We have developed a silver sintering die-attach film designed for application at wafer level. It delivers the superior reliability and performance of silver sintering in a high throughput process that utilizes a standard epoxy die bonder. This paper describes the challenges and process solutions for using the wafer level silver sintering film.