XHPTM 2 – The low-inductive, multi-package housing for the next generation of high-power applications

Abstract:
The harmonization of power electronic platforms for various urban transportation and their different operation voltages is one of the major requirements for future-oriented developments. In addition, new and upcoming technologies in switching devices like IGBT5/.XT or SiC MOSFETs in high-power applications make the increase of current density possible. As a result, size and volume have been reduced, advantages that support such harmonized platforms. A low-inductive, high-current and symmetrical power-module design fulfilling the requirements for both low and high operation voltages at the same time is needed. In this work we discuss the low-inductive concept of XHPTM 2 for high-power applications, switching characteristics, and the extended module lifetime with IGBT5/.XT technology.