Study of POL tile using Ag sintering material
Conference: PCIM Europe digital days 2020 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
07/07/2020 - 07/08/2020 at Deutschland
Proceedings: PCIM Europe digital days 2020
Pages: 6Language: englishTyp: PDF
Authors:
Murayama, Kei; Aizawa, Mitsuhiro; Hayashibe, Shingo; Tajima, Kiyoko; Oi, Kiyoshi (SHINKO Electric Industries Co. Ltd., Japan)
Abstract:
Power Overlay (POL) tile gets remarkable attention as a power module that enable to bring out the capabilities of Wide Band Gap (WBG) devices. In this report, we will report on an advantage and a disadvantage of using Ag sintering technology on POL tile. In case of using sintering material for POL tile, low temperature process is available and void risk of the connection portion can be reduced compared with the conventional solder interconnection. On the other hand, in order to perform uniform pressurization, group tool for sintering process were required. The possibility of adopting Ag sintering technology for POL tile was shown.