Bonding with copper paste for pressure sintering process
Conference: PCIM Europe digital days 2020 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
07/07/2020 - 07/08/2020 at Deutschland
Proceedings: PCIM Europe digital days 2020
Pages: 4Language: englishTyp: PDF
Authors:
Yamauchi, Shinichi; Anai, Kei; Jo, Jung-Lae; Sakaue, Takahiko (Engineered Materials Sector R&D Center Mitsui Mining & Smelting Co. Ltd., Japan)
Chang, J. Y.; Fun, S. Y.; Cheng, H.W.; Chang, T.C. (Intelligent Power Module & System Department, Electronics and Optoelectronics System Research Laboratories, Industrial Technology Research Institute, Taiwan, R.O.C.)
Abstract:
Copper sintered material has been considered as the alternative to die joining and attaching. In this study, we develop the pressure-sintered Cu paste as a joining material to observe its property when proceeding a batch sintering process of multiple chips with different heights. High shear strength of each chip after sintering was found. The result shows that the Cu sinter paste can be applied to pressure sintering process for mass production.