Advanced Adhesives based on Carbon Nanotube Technology
Conference: Smart Systems Integration 2008 - 2nd European Conference & Exhibition on Integration Issues of Miniaturized Systems - MOMS, MOEMS, ICS and Electronic Components
04/09/2008 - 04/10/2008 at Barcelona, Spain
Proceedings: Smart Systems Integration 2008
Pages: 4Language: englishTyp: PDF
Personal VDE Members are entitled to a 10% discount on this title
Authors:
Fecht, Hans-Jörg (Institute of Micro and Nanomaterials, Ulm University, Ulm)
Leson, Andreas (Fraunhofer Institut für Werkstoff- und Strahltechnik, Dresden, Germany)
Michel, Bernd (Fraunhofer Institut für Zuverlässigkeit und Mikrointegration, Department Micro Materials Center, Berlin, Germany)
Werner, Matthias (NMTC – Nano & Micro Technology Consulting, Berlin, Germany)
Abstract:
For microsystems packaging and system integration new processing techniques are being developed on the basis of advanced composites using nanoscale building blocks - here carbon nanotubes - incorporated in relevant interconnect materials, such as metallic solders and highly conductive polymer based adhesives.