Automating Photonic Systems-in-Package Assembly for High Performance Glass Interposers
Conference: ECOC 2024 - 50th European Conference on Optical Communication
09/22/2024 - 09/26/2024 at Frankfurt, Germany
Proceedings: ITG-Fb. 317: ECOC 2024
Pages: 4Language: englishTyp: PDF
Authors:
Shortiss, Kevin; Hwang, How Yuan; Parra, Josue; Butler, Sharon; Wang, Hsiang-Chu; Ghomashi, Mohammadamin; Li, Yanlu; Noell, Wilfried; Seyfried, Moritz; O'Brien, Peter
Abstract:
Interest in high performance glass interposers has been growing, due to the advantages which have been demonstrated over standard silicon interposers. In this paper, we demonstrate fully auto-mated micro-optics and laser sub-assembly alignment and laser-assisted bonding processes which are compatible with glass interposers.