Demonstration of wafer-level integrated permanent bias micromagnets for magnetic field sensors
Conference: MikroSystemTechnik Kongress 2023 - Kongress
10/23/2023 - 10/25/2023 at Dresden, Deutschland
Proceedings: MikroSystemTechnik Kongress 2023
Pages: 5Language: englishTyp: PDF
Authors:
Ziegler, Florian; Clausen, Niels; Lisec, Thomas (Fraunhofer Institute for Silicon Technology ISIT, Itzehoe, Germany)
Cichon, Daniel; Stahl-Offergeld, Markus; Hohe, Hans-Peter (Fraunhofer Institute for Integrated Circuits IIS, Erlangen, Germany)
Schroeder, Dominik; Hedayat, Christian (Fraunhofer Institute for Electronic Nano Systems ENAS, Paderborn, Germany)
Gojdka, Bjoern (Fraunhofer Institute for Silicon Technology, Itzehoe, Germany)
Abstract:
For the demonstration of magnetic biasing with wafer-level integrated permanent magnets, a Hall sensor is equipped with a back bias magnet by directly integrating the magnet into the silicon substrate. For this purpose, a powder-based micro-fabrication technique, called PowderMEMS, is utilized. The plausibility of the approach to equip magnetic sensors with substrate-integrated bias magnets is investigated by simulation and measurement of the rotation of a soft magnetic gear wheel, representing a typical biased sensor application. In addition, shaping of the magnetic field distribution using customized magnet geometries is performed and investigated.